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TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
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Signal Integrity

In addition to our development work in optical electronics as well as high frequency RF products, we continue to extend digital copper signaling bandwidth up to and beyond 25 Gbps. We focus on key aspects at every phase, from concept through production. We enable this capability by selecting the correct circuit geometries, dielectric materials and process methodologies which impact signal integrity.

Validating the SI performance at the PCB level is completed using traditional TDR and when needed high frequency scopes to validate insertion loss for the most demanding applications.

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