TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
TTM Products
Skip Navigation LinksHome > Products & Services > FLAT WRAP? Technology

FLAT WRAP™ Technology

TTM's Engineering Teams has developed an innovative process: FLAT-WRAP™ Technology.

This patented technology eliminates the need for additional surface plated copper required to meet the IPC specification for wrap plating (ref. IPC 6012B Amendment 1 p.

FLAT-WRAP™ Technology results in consistent wrap plate thickness matching the thickness of the initial surface foil.

FLAT-WRAP™ Technology is suited for design applications with multiple wrap plating requirements and fine pitch trace and space on plated layers, typically sequential lam jobs or standard thru hole Via-In-Pad requiring conductive or non-conductive via fill. Conventional processing methods to satisfy the wrap plating requirements limit the fabricator's capability for producing high-density surface features. Fine pitch trace and space limitations are magnified in designs requiring multiple wrap plating or sequential lamination steps. Efforts to maintain minimum wrap plating thicknesses in PCBs manufactured with conventional wrap plating often lead to design compromises and/or deviations.

TTM FLAT-WRAP™ Technology provides the following benefits:

  • Increased reliability due to wrap plate uniformity over the entire panel surface
  • Elimination of copper thickness build-up during multiple wrap plating cycles on a common layer
  • Improved surface plating distribution provides consistent impedance values on the plated layers with via-filled holes
  • Improved dielectric thickness on all sub-laminations between the sub-outer plated layer and the subsequent laminated layer
  • Reduced surface copper thickness enables designs with fine lines and tighter geometries
  • Improved soldermask thickness uniformity due to reduced copper feature height


  • TTM FLAT-WRAP™ Technology (3x wrap on a common layer after 6x thermal stress)


  • Conventional Wrap Plating (3x wrap on a common layer after 6x thermal stress)



河北快三推荐号码app 中国彩票预测网站 重庆农场快乐10分走势图 捉鸡麻将技巧顺口溜 河北十一选五预测技巧 大宝lg游戏pt游戏cq游戏娱乐 哈灵浙江麻将下载安装 36棋牌平台 优乐江西麻将下载安 广东26选5玩法 老k棋牌客服怎么找 微信捕鱼提现 河北排列7走势图0376355 百赢棋牌害了多少人 白城52麻将下载洮南 浙江11选五5开奖结果遗漏 七星彩专家杀号2元