TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
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TTM is a global leader providing complex printed circuit boards (PCBs), backplanes, backplane assemblies and electro-mechanical/metal integration to the high-end computing, cloud computing, storage and switch/router sectors.

From the fast growing tablet PC market that requires "any layer" microvia technology to high-end servers and storage systems, TTM supplies advanced technology PCBs to the world's largest companies.

Printed Circuit Boards

The unparalleled combination of our U.S. quick-turn and advanced technology production facilities, high-volume manufacturing plants in North America and China, and global technical support centers provides the optimum solution for computing customers who require full product life-cycle manufacturing support of high-technology, high-reliability products. Key PCB technologies include:

  • Backdrilling
  • High Speed/Low Loss materials
  • Ultra High Aspect Ratio Line Cards
  • HDI
  • Lead-free manufacturing capabilities
  • Via fill
  • 50+ layers
  • Kelvin Probe testing for improved reliability
  • Quick-turn and seamless transition to volume production

Electro-Mechanical Solutions

TTM provides the full spectrum of electro-mechanical needs for the computer market, including:

  • Full technology range PCB's and assemblies
  • Large-format backplanes and assemblies
  • Custom wire harnesses and cable assemblies
  • Bus bar manufacturing
  • Sheet metal racks, cabinets and enclosures
  • Integration assembly, testing and logistics
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